1. Pin Type (6DFA, 6DFB) Pre-Heat: 150 o C, 60 sec. max. Flow Soldering: 260 o C max., 5 sec. max. 2. SMD type (4DFA, 4DFB)       Temperature Profile (surface temp of land portion) Pre-Heat Reflow: 1. 150-160o C , 60 sec. max. 2. 160o C min., 45sec. max. 3. 200o C min., 30 sec. max. 4. 230±5o C , 5sec. max. TDF series Recomended Soldering Profile 4DFA Type Soldering Pattern Layout 4DFB Type Soldering Pattern Layout

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